Proceedings Paper Submission/Author Instructions
The 2012 IEEE International Power Modulator and High Voltage Conference Proceedings of the papers will be published in a print version and on CD-ROM from your original file of the papers. A technical manuscript is expected for each abstract that has been accepted into the conference technical program. There are tremendous lasting rewards for your paper to be included in the conference proceedings, as they will serve as a permanent record in the literature and be available on IEEE Xplore®.
Manuscripts will NOT be accepted for publication in the conference proceedings or in IEEE Xplore® if the oral or poster presentation is not given by one of the authors (as identified in the abstract) at the proper session/slot in the technical program. The author must also be a registered attendee of the conference.
All manuscripts must be submitted electronically by 5:00 PM, Friday June 15, 2012 and follow the format for IEEE conference papers. The submission website will be the same as that used for abstract collection and will be available on May 1, 2012 to begin accepting manuscripts.
Manuscript templates are provided below. Two different versions are available with one set up for letter size paper and one utilizing A4.
Contributed oral and poster papers may be up to 4 pages in length, invited oral papers up to 6 pages, and plenary papers up to 8 pages. Conference proceedings will be printed in Black and White although papers submitted to IEEE Xplore may include color material. Authors should keep in mind that graphics, photos, diagrams, legends, etc. should be legible and understandable in both cases.
All papers should be submitted as PDF, and they must be IEEE Xplore®-compatible. Please convert your file into PDF or check the compatibility of your PDF with IEEE PDF eXpress. The PDF eXpress application will be made available on April 1, 2012.
PDF Compatibility Check:
The IEEE PDF eXpress utility has been provided to check for proper PDF compatibility. Please use the following web link to test your PDF version of the manuscript prior to submitting it for publication.
PDF eXpress application link: http://www.pdf-express.org
PDF eXpress user instructions are found HERE
For new users:
Conference ID: IPMHVC2012x
Use your e-mail address and choose a new password.
Continue to enter information as prompted.
To submit your 2012 IPMHVC paper, please use the abstract submission link.
- Enter username/password (same as for the abstract submission)
- Click on "Go to Abstract/Paper Submission"
- A table should appear that has your abstract submission information
- Under Manuscript Options (next to your abstract submission number), click on "Upload"
- Follow the conference paper upload instruction
- Please remember to also follow the instructions for electronic copyright transfer to IEEE
Paper submission link: http://meetingassistant.com/IPMHVC2012/
Submitted papers will undergo a peer review as required by IEEE. Authors may be contacted within 3 weeks after the conference if reviewers suggest changes to the paper. Authors are also STRONGLY urged to follow the format of the template listed above as formatting issues are a common cause for paper rejection and return for further editting.
If you have any questions regarding the requirements or guidelines, please contact Dr. Juergen Kolb (email@example.com).
IEEE TDEI Special Issue Announcement
Following past tradition, the August 2013 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Power Modulators, Repetitive Pulsed Power and High Voltage topics. This issue is open to any and all potential authors. Presenters of papers at the 2012 IEEE International Power Modulator and High Voltage Conference are especially encouraged to submit their work to this special issue. Since IEEE prohibits conference proceedings papers from being republished, authors of papers accepted into the IPMHVC proceedings are strongly encouraged to significantly expand and enhance their conference manuscripts before submitting for inclusion in this special issue.
Manuscript submission deadline: September 30, 2012
Guest Editor: Dr. Juergen Kolb and Dr. David Wetz
First Call: TDEI Special Issue Call for Papers
TDEI Manuscript Template: TDEI Manuscript Microsoft Word Template
TDEI Special Issue Submission Website: TDEI Special Issue Submission Website